Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive

Product Details
Customization: Available
CAS No.: None
Formula: None
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1000000 RMB
Plant Area
101~500 square meters
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
  • Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
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  • Overview
  • Product Description
  • Specification
  • Related Goods
  • Company Profile
Overview

Basic Info.

Model NO.
Polyamide Hot Melt Adhesive
EINECS
None
Molecular Principal Chain
Polyamide Hot Melt Adhesive
Color
Pale Yellow
Acid Value
5min
Amine Value
5min
Solvent Viscosity
150-450
Melt Viscosity
1500-8000
Softening Point
105-130
Transport Package
Kraft Bag Lined with Plastic Bag, 25kg/Bag Net.
Specification
40% Polyamide Hot Melt Adhesive
Trademark
Briture
Origin
China
Production Capacity
3000metric Ton/Year

Packaging & Delivery

Package Size
30.00cm * 25.00cm * 20.00cm
Package Gross Weight
25.200kg

Product Description

Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
 
Product Description

Polyamide  Hot Melt Adhesive  is the polycondensate  of dimer  acid and  diamine.It is  solid at room temperature,but liquid uner melting state with good liguidity and adhesive ability,and will form high strength adhesion after
solidifying and cooling. Polyamide hot melt adhesive has excellent thermostability and flexibility,as well as good solubility &  melting properties at low temperature.

1 .   Chemistry name: polyamide hot melt adhesive.
2 .   Appearance:  light yellow granular transparent solid.
3 .   Properties: non- toxic, no irritant, dissolve in most organic solvents, insoluble in water. polyamide hot melt adhesive has a good  solubility at low temperature,  high temperature melting,  excellent thermal stability and strong flexibility stretchability.  
4 .   Application: mainly used for attire, shoes, leather, electronic devices, melting adhesive. Also used for wood, plastic, metal, ceramics etc.

5 .   Packing: kraft bag lined with plastic bag, 25kg/bag net.
6 .   Storage: to be stored in cool, ventilated and dry place.

 
Specification

 

Item Index
BT-208A BT-208B BT-208C BT-288 BT-208E
Acid value ( mgKOH/ g) ≤ 5 ≤ 5 ≤ 5 ≤ 5 ≤ 6
Amine value     (mgKOH/ g) ≤ 5 ≤ 5 ≤ 5 ≤ 5 ≤ 6
Solvent viscosity* (mPa  · s/25ºC) 150- 190 200-300 250-450 200-400 250-450
Melt viscosity (mPa  ·s/ 160ºC) 1500-3000 2000-4500 2000-5000 2000-4500 3000-8000
Softening point (ºC) 105- 115 105- 115 100- 110 95- 105 110- 130
Color (Fe-Co) ≤ 8 ≤ 8 ≤ 8 ≤ 8 ≤ 8

*4 0%  Polyamide Hot Melt Adhesive,  60%  Mixed reagent
 
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Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
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Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
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Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive

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Company Profile

 

Briture Polyamide Hot Melt Adhesive for Electronic Devices and Melting Adhesive
 

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